絕緣子樹脂與金屬嵌件熱應(yīng)力研究
盧銀花，侯亞峰，鄭林楠，陳蕊，吳明清
（河南平高電氣股份有限公司，河南 平頂山 467001）
摘 要：采用瞬態(tài)溫度場與瞬態(tài)結(jié)構(gòu)場耦合的計(jì)算方法，研究環(huán)氧樹脂絕緣子產(chǎn)品在固化后的去應(yīng)力過程中樹脂內(nèi)部所受到的熱應(yīng)力情況。以盆式絕緣子為對象，研究金屬嵌件應(yīng)力槽大小對絕緣子熱應(yīng)力的影響；以帶中心導(dǎo)筒體的絕緣盤為對象，研究中心筒體壁厚對絕緣子熱應(yīng)力的影響。結(jié)果表明：隨著應(yīng)力槽的深度和寬度的增加，熱應(yīng)力的變化曲線呈現(xiàn)出凹字形分布，絕緣子內(nèi)部熱應(yīng)力最大值位置均出現(xiàn)在與金屬嵌件相結(jié)合面上；隨著中心筒體壁厚逐漸增大，絕緣盤所受到的熱應(yīng)力逐漸增加。
關(guān)鍵詞：絕緣子；金屬嵌件；應(yīng)力槽；熱應(yīng)力耦合場
中圖分類號：TM216+.3 文獻(xiàn)標(biāo)識(shí)碼：A 文章編號：1007-3175(2020)02-0023-04
Study on Thermal Stress of Insulator Resin and Metal Insert
LU Yin-hua, HOU Ya-feng, ZHENG Lin-nan, CHEN Rui, WU Ming-qing
（Henan Pinggao Electric Co., Ltd, Pingdingshan 467001, China）
Abstract: The calculation method of transient temperature field and transient structural field coupling was adopted to study on the thermal stress inside the resin of epoxy resin insulator products in the process of stress relieving after curing. The basin-type insulator was taken as the research object to study on the influence of the stress slot size of the metal insert on the thermal stress of the insulator; the insulation disc of band center conducting cylinder was taken as the research object to study on the influence of center cylinder wall thickness on the insulator thermal stress. The result indicates that as the depth and width of the stress slot increases, the distribution of concave glyph is shown in the curve of thermal stress and the location of maximum thermal stress appears on the interface between the insulator and the metal insert. As the wall thickness of the central cylinder gradually increases, the thermal stress on insulating disc gradually increases.
Key words: insulator; metal insert; stress slot; thermal-stress coupled field
參考文獻(xiàn)
[1] 鄭天祺. 環(huán)氧樹脂/ 酸酐固化體系復(fù)合絕緣材料的殘余應(yīng)力特性研究[D]. 合肥：合肥工業(yè)大學(xué)，2018.
[2] 郭子豪，王浩然，李禾，等. 特高壓盆式絕緣子水壓試驗(yàn)中應(yīng)力應(yīng)變分布的仿真計(jì)算與光纖測量[J].高電壓技術(shù)，2018，44(3)：993-1002.
[3] 魏洪，鄭茂亮，范瑞娟. 復(fù)合材料與金屬結(jié)構(gòu)連接熱應(yīng)力有限元分析[J]. 航空科學(xué)技術(shù)，2015，26(9)：33-36.
